Metrosemi

Semiconductor Surface-Inspection Metrology

Stress Measurement Tool

FSM 128
FSM 128L Film stress and wafer bow measurement for wafers up to 300mm diameter. 2D/3D stress mapping standard. Semi-automated system with convenient wafer loading.
FSM 128C2C
The FSM 128C2C series is a fully automated system designed for stringent production environments, including next-generation devices in 300mm fabs, III-V, and MEMS industries.
FSM 500
FSM 500TC Bow Height, Stress Hysteresis Measurement up to 500C for thermal property and stability tests of thin films during thermal cycling up to 500 degrees C in inert gas.
FSM 900C2C
FSM 900TC Rapid Thermal Mechanical Characterization of novel materials. Simultaneous extraction of stress hysteresis, thermal desorption during thermal cycling up to 900C.

Thickness Measurement Tool

FSM 413
FSM413-MOT Thickness and total thickness variation (TTV) mapping system. TTV & Thickness, Roughness of wafer, thick layers, wafers on tape & bonded wafers under various conditions.
F50s
F50s are general-purpose film thickness measurement instruments, and are used in thousands of applications worldwide. Thickness measured in less than a second.
TSM-2000
The TMS-2000 can measure the flatness of the wafer with up to 1 nm repeatability. Unique data acquisition software for consistent measurement & high environmental stability.
M-2000®
The M-2000® ELLIPSOMETER line of spectroscopic ellipsometers is engineered to meet the diverse demands of thin film characterization. An advanced optical design.

Defect Inspection Tool

Surfscan® SP7XP
The Surfscan® SP7XP unpatterned wafer inspection system facilitates qualification and monitoring of processes and tools for IC, wafer and materials manufacturers.
Candela® 8720
The Candela® 8720 advanced surface inspection system captures a variety of mission-critical substrate and epitaxial defects for the LED, photonics.
W SERIES MICRO XRF
W SERIES MICRO XRF uses poly-capillary optics to focus the X-ray beam to 7.5 µm FWHM, the world’s smallest for coating thickness analysis using XRF instruments.
HMI eScan 1100
HMI eScan 1100 The multiple e-beam wafer inspection system for in-line defect inspection applications. Following in the footsteps of the eScan 1000,

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